Single-sided assembly:

Incoming inspection => screen printing paste (point patch glue) => patch => drying (curing) => reflow soldering => cleaning => testing => rework

Double-sided assembly:

A: incoming inspection => A surface of PCB solder paste (point patch glue) => PCB B surface solder paste (point patch glue) => patch => drying => reflow soldering Best only for B surface => cleaning => test => rework).

B: incoming inspection => A side of the PCB solder paste (point patch glue) => patch => drying (curing) => A side reflow soldering => cleaning => flap = PCB B point Patch glue => patch => curing => B wave soldering => cleaning => testing => rework) Shanghai chip processing

This process is suitable for PCB surface A reflow, B wave soldering. This process should be used when the SOT or SOIC (28) pins on the PCB side B are assembled. Electronics OEM OEM

Third, single-sided mixing process:

Incoming inspection = PCB A side silk screen solder paste => patch => drying (curing) => reflow soldering => cleaning => plug => wave soldering => cleaning => detection = > Rework

Fourth, double-sided mixing process:

A: incoming inspection => PCB B-side patch glue => patch => curing => flap => PCB A side insert => wave soldering => cleaning => testing => rework

After the paste after the paste, SMD components for more than the case of discrete components

B: incoming inspection => A side of the PCB plug-in (pin bending) => flap => PCB B point patch glue => patch => curing => flap => wave soldering => cleaning => Detect => Rework

After the first insert, suitable for the separation of components more than the SMD components of the situation

C: incoming inspection => PCB A side silk screen solder paste => patch => drying => reflow soldering => plug-in, pin bending => flap => PCB B surface patch glue => SMD => Curing => flap => wave soldering => cleaning => testing => rework A surface mixed, B surface mounted.

D: incoming inspection => B surface of the PCB patch glue => patch => curing => flap => PCB A side silk screen solder paste => patch => A surface reflow => plug = B surface wave soldering => cleaning => testing => rework A surface mixed, B surface mounted. The first paste on both sides of the SMD, reflow soldering, after the plug-in, wave soldering E: incoming inspection => PCB B side screen printing solder paste => Patch => drying (curing) => reflow soldering = > Flap => PCB A side silk screen solder paste => patch => Drying = reflow soldering 1 (local welding can be used) => plug-in => wave soldering 2 (such as the instrumentation components less, the use of manual welding) => Cleaning => Testing => Rework A surface mounted, B surface mixed.

Five, double-sided assembly process

A: incoming inspection, PCB A side silk screen solder paste (patch glue), patch, drying (curing), A surface reflow soldering, cleaning, flap; PCB B side silk screen solder paste Glue), patch, drying, reflow soldering (preferably only on the B side, cleaning, testing, rework)

This technology is suitable for mounting larger PLCs such as PLCC on both sides of the PCB.

B: incoming inspection, PCB A side silk screen solder paste (patch adhesive), patch, drying (curing), A surface reflow soldering, cleaning, flap; , Curing, B Wave Soldering, Cleaning, Inspection, Rework) This process is suitable for reflow on the A side of the PCB.