◆ SMT chip processing characteristics

High assembly density, small size electronic products, light weight, the volume and weight of the patch components only traditional cartridge components about 1/10 or so, SMT chip OEM SMT chip processing, the electronic products reduced by 40% 60%, weight loss of 60% to 80%.

High reliability, anti-vibration ability. Solder joint defect rate is low.

Good high-frequency characteristics. Reduced electromagnetic and radio frequency interference.

Easy to automate and increase productivity. Reduce costs up to 30% to 50%. Save material, energy, equipment, manpower, time and so on.

◆ Why use surface mount technology (SMT)?

Pursuit of miniaturization of electronic products, previously used perforated plug-in components can not be reduced

Electronic products more complete function, the integrated circuit (IC) used has no perforation components, especially large-scale, highly integrated IC, had to use surface mount components

Product batch, production automation, the factory to low-cost high-volume production of products to meet customer needs and enhance market competitiveness

The development of electronic components, the development of integrated circuits (ICs) and the diversified application of semiconductor materials

The revolution in electronic science and technology is imperative, chasing the international trend

◆ Why the application of surface-mount technology-free cleaning process?

Wastewater discharged after product cleaning in the production process brings pollution to the water quality, the earth and even plants and animals.

In addition to water cleaning, the use of chlorofluorocarbon-containing organic solvents (CFC & HCFC) for cleaning, but also the air and atmosphere pollution, destruction.

Residual cleaning agent on the board caused by corrosion, seriously affecting the quality of products.

Reduce cleaning process operations and machine maintenance costs.

No-clean reduces the damage done to the PCBA during movement and cleaning. There are still some components unbearable cleaning.

Flux residue has been controlled, with the appearance of the product requirements to use, to avoid the visual inspection of the cleaning status of the problem.

Residual flux has been continuously improving its electrical properties to avoid leakage of finished products, resulting in any injury.

No-clean process has passed a number of international safety tests to prove that the flux of chemical substances is stable, non-corrosive