Ultrasonic cleaning is useful for removing the flux remaining on the PCB. Drawback is controlled by the size of the ultrasonic power, SMT chip manufacturers ultrasonic power is too low is ineffective, while the ultrasonic power is too high will damage the PCB and the above components.

  Ultrasonic cleaning may cause two kinds of damage consequences: SMT chip processing

(1) The impact of small droplets on the surface is like sandblasting, similar to the surface weathering.

(2) In the cleaning tank, the ceramic substrate is excited by the ultrasonic load and presents a resonance state. On the substrate, the pins of the surface mount components are periodically affected by the common-harmonic frequency, eventually resulting in fatigue fracture at the bend of the pins.